ISD1420P

play back device, DIP, -0.3V to +7.0V

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Price:: US $2.80~4.50 / piece [Get Latest Price]

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	US $2.80~4.50

PartNumber:: ISD1420P

Brand:: International Software Development (Shenzhen) Co. Ltd. - ISD | Pack: DIP | D/C: 06+

Availability:: Supply Ability: 10000/Week Can Ship Immediately
Delivery: 10-15 Business Days (ships out within 3 Business days)

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Products Upload time: 2011-07-12

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Product Summary

The ISD1420P is a single-chip voice record/play back device. It provides high-quality, single-chip record/playback solutions to short-duration mesaging applications. The ISD1420P CMOS device includes an onchip oscillator, microphone preamplifier, automatic gain control, antialiasing filter, smoothing fliter, and speaker amplifier. A minimum record/playback system of the ISD1420P can be confligured with a microphone, a speraker, several passives, two push buttons, and a power source. Recording are stored in on-chip nonvolatile memory cells, providing zero-power message storage. This unique, singel-chip solution is made possible through patented multilievel storage technology. Voice and audio signals of the ISD1420P are stored directly into memory in their natural form, providing high-quality, solid-state voice reproduction.

Parametrics

ISD1420P absolute maximum ratings: (1)junction temperature: 150℃; (2)storage temperature range: -65 to 150℃; (3)voltage applied to any pin: VSS-0.3V to VCC+0.3V; (4)voltage applied to any pin (input current limited to ±20mA): VSS-1.0V to VCC+1.0V; (5)lead temperature (soldering -10seconds): 300℃; (6)VCC-VSS: -0.3V to +7.0V.

Features

ISD1420P features: (1)easy to use single chip voice record/playback solution; (2)high quality, natural voice/audio reproduction; (3)push button interface; (4)single chip duration of 16 and 20 seconds; (5)automatic power down mode; (6)zero power message storage; (7)fully addressable to handle multiple messages; (8)100 year message retention typical; (9)on chip clock source; (10)no pragrammer or development system needed; (11)singel +5Volt power supply; (12)avaliable in die form, DIP and SOIC packing; (13)industrial temperature -40℃ to +85℃ versions abaliable.