XC2V1000-5FG256C

Product Summary

The XC2V1000-5FG256C is a platform FPGA developed for high performance from low-density to high-density designs that are based on IP cores and customized modules. The XC2V1000-5FG256C delivers complete solutions for telecommunication, wireless, networking, video, and DSP applications, including PCI, LVDS, and DDR interfaces. The leading-edge 0.15 μm / 0.12 μm CMOS 8-layer metal process and the Virtex-II architecture are optimized for high speed with low power consumption. Combining a wide variety of flexible features and a large range of densities up to 10 million system gates, the XC2V1000-5FG256C enhances programmable logic design capabilities and is a powerful alternative to mask-programmed gates arrays.

Parametrics

Absolute maximum ratings:(1)Internal supply voltage relative to GND, VCCINT: –0.5 to 1.65V; (2)Auxiliary supply voltage relative to GND, VCCAUX: –0.5 to 4.0V; (3)Output drivers supply voltage relative to GND, VCCO: –0.5 to 4.0V; (4)Key memory battery backup supply, VBATT: –0.5 to 4.0V; (5)Input reference voltage –0.5 to VCCO, VREF: + 0.5V; (6)Input voltage relative to GND (user and dedicated I/Os), VIN: –0.5 to VCCO + 0.5V; (7)Voltage applied to 3-state output (user and dedicated I/Os), VTS: –0.5 to 4.0V; (8)Storage temperature (ambient), TSTG: –65 to +150℃; (9)Maximum junction temperature, TJ: +125℃.

Features

Features:(1)Industry First Platform FPGA Solution; (2)IP-Immersion Architecture; (3)SelectRAM Memory Hierarchy; (4)High-Performance Interfaces to External Memory; (5)Flexible Logic Resources; (6)High-Performance Clock Management Circuitry; (7)Supported by Xilinx Foundation and Alliance Series Development Systems; (8)SRAM-Based In-System Configuration; (9)0.15 μm 8-Layer Metal Process with 0.12 μm High-Speed Transistors; (10)1.5V (VCCINT) Core Power Supply, Dedicated 3.3V VCCAUX Auxiliary and VCCO I/O Power Supplies; (11)IEEE 1149.1 Compatible Boundary-Scan Logic Support; (12)Flip-Chip and Wire-Bond Ball Grid Array (BGA) Packages in Three Standard Fine Pitches (0.80 mm, 1.00 mm, and 1.27 mm); (13)Wire-Bond BGA Devices Available in Pb-Free Packaging; (14)100% Factory Tested.

Diagrams