XC5VLX220T-2FFG1738I

Product Summary

The XC5VLX220T-2FFG1738I provides the newest most powerful features in the FPGA market. Using the second generation ASMBL (Advanced Silicon Modular Block) column-based architecture, the Virtex-5 family contains five distinct platforms (sub-families), the most choice offered by any FPGA family. Each platform contains a different ratio of features to address the needs of a wide variety of advanced logic designs. In addition to the most advanced, high-performance logic fabric, Virtex-5 FPGAs contain many hard-IP system level blocks, including powerful 36-Kbit block RAM/FIFOs, second generation 25 x 18 DSP slices, SelectIO technology with built-in digitallycontrolled impedance, ChipSync source-synchronous interface blocks, system monitor functionality, enhanced clock management tiles with integrated DCM (Digital Clock Managers) and phase-locked-loop (PLL) clock generators, and advanced configuration options.

Parametrics

Absolute maximum ratings:(1)Internal supply voltage relative to GND, VCCINT: –0.5 to 1.1V; (2)Auxiliary supply voltage relative to GND, VCCAUX: –0.5 to 3.0V; (3)Output drivers supply voltage relative to GND, VCCO: –0.5 to 3.75V; (4)Key memory battery backup supply, VBATT: –0.5 to 4.05V; (5)Input reference voltage, VREF: –0.5 to 3.75V; (6)3.3V I/O input voltage relative to GND(user and dedicated I/Os) ,VIN: –0.75 to 4.05V; (7)3.3V I/O input voltage relative to GND (restricted to maximum of 100 user I/Os), VIN: –0.95 to 4.4V(Commercial Temperature); (8)3.3V I/O input voltage relative to GND (restricted to maximum of 100 user I/Os),VIN: –0.85 to 4.3V(Industrial Temperature); (9)2.5V or below I/O input voltage relative to GND (user and dedicated I/Os),VIN: –0.75 to VCCO+0.5V; (10)Current applied to an I/O pin, powered or unpowered ,IIN: ±100mA; (11)Total current applied to all I/O pins, powered or unpowered ,IIN: ±100mA; (12)Voltage applied to 3-state 3.3V output (user and dedicated I/Os), VTS: –0.75V to 4.05V; (13)Voltage applied to 3-state 2.5V or below output (user and dedicated I/Os), VTS: –0.75V to VCCO+0.5V; (14)Storage temperature (ambient), TSTG: –65 to 150℃; (15)Maximum soldering temperature, TSOL: +220℃; (16)Maximum junction temperature, TJ: +125℃.

Features

Features: (1)Five platforms LX, LXT, SXT, TXT, and FXT; (2)Cross-platform compatibility; (3)Most advanced, high-performance, optimal-utilization, FPGA fabric; (4)Powerful clock management tile (CMT) clocking; (5)36-Kbit block RAM/FIFOs; (6)High-performance parallel SelectIO technology; (7)Advanced DSP48E slices; (8)Flexible configuration options; (9)System Monitoring capability on all devices; (10)Integrated Endpoint blocks for PCI Express Designs; (11)Tri-mode 10/100/1000 Mb/s Ethernet MACs; (12)RocketIO GTP transceivers 100 Mb/s to 3.75 Gb/s; (13)RocketIO GTX transceivers 150 Mb/s to 6.5 Gb/s; (14)PowerPC 440 Microprocessors; (15)65-nm copper CMOS process technology; (16)1.0V core voltage.

Diagrams