(Hong Kong)
Product Summary
The TLP181GB is a small outline coupler, suitable for surface mount assembly. The device consists of a photo ransistor optically coupled to a gallium arsenide infrared emitting diode in a four lead plastic DIP package. The applications of the device include office machine, progranmmable controllers, AC/DC input module and telecommunication.
Parametrics
TLP181GB absolute maximum ratings: (1)LED, forward current, IF: 50mA; forward current detating, △IF/℃: -0.7mA/℃; pulse forward current, IFP: 1A; reverse voltage, VR: 5V; junction temperature, Tj: 125℃; (2)detector, collector-emitter voltage, VCEO: 80V; emitter-collector voltage, VECO: 7V; collector current, IC: 50mA; collector power dissipation, PC: 150mW; collector power dissipation derating, △PC/℃: -1.5mW/℃; junction temperature, Tj: 125℃; (3)storage temperature range, Tstg: -55 to 125℃; (4)operating temperature range, Topr: -55 to 100℃; (5)lead soldering temperature, Tsol: 260℃; (6)total package power dissipation, PT: 200mW; (7)total package power dissipation derating, △PT/℃: -2.0mW/℃; (8)isolation voltage, BVS: 3750Vrms.
Features
TLP181GB features: (1)collector-emitter voltage: 80V min; (2)current transfer ratio: 50% min; (3)rank GB: 100% min; (4)isolation voltage: 3750Vrms min; (5)UL recognized: UL1577, file No E67349.
Diagrams
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 TLP181GB |
Other |
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Data Sheet |
Negotiable |
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TLP1000A |
Other |
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Data Sheet |
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TLP1002A. |
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Data Sheet |
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Data Sheet |
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TLP1006A |
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Data Sheet |
Negotiable |
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